#![allow(
clippy::approx_constant,
clippy::useless_vec,
clippy::len_zero,
clippy::unnecessary_cast,
clippy::redundant_closure,
clippy::too_many_arguments,
clippy::type_complexity,
clippy::needless_borrow,
clippy::enum_variant_names,
clippy::upper_case_acronyms,
clippy::inconsistent_digit_grouping,
clippy::unit_cmp,
clippy::assertions_on_constants,
clippy::iter_on_single_items,
clippy::expect_fun_call,
clippy::redundant_pattern_matching,
variant_size_differences,
clippy::absurd_extreme_comparisons,
clippy::nonminimal_bool,
clippy::for_kv_map,
clippy::needless_range_loop,
clippy::single_match,
clippy::collapsible_if,
clippy::needless_return,
clippy::redundant_clone,
clippy::map_entry,
clippy::match_single_binding,
clippy::bool_comparison,
clippy::derivable_impls,
clippy::manual_range_contains,
clippy::needless_borrows_for_generic_args,
clippy::manual_map,
clippy::vec_init_then_push,
clippy::identity_op,
clippy::manual_flatten,
clippy::single_char_pattern,
clippy::search_is_some,
clippy::option_map_unit_fn,
clippy::while_let_on_iterator,
clippy::clone_on_copy,
clippy::box_collection,
clippy::redundant_field_names,
clippy::ptr_arg,
clippy::large_enum_variant,
clippy::match_ref_pats,
clippy::needless_pass_by_value,
clippy::unused_unit,
clippy::let_and_return,
clippy::suspicious_else_formatting,
clippy::manual_strip,
clippy::match_like_matches_macro,
clippy::from_over_into,
clippy::wrong_self_convention,
clippy::inherent_to_string,
clippy::new_without_default,
clippy::unnecessary_wraps,
clippy::field_reassign_with_default,
clippy::manual_find,
clippy::unnecessary_lazy_evaluations,
clippy::should_implement_trait,
clippy::missing_safety_doc,
clippy::unusual_byte_groupings,
clippy::bool_assert_comparison,
clippy::zero_prefixed_literal,
clippy::await_holding_lock,
clippy::manual_saturating_arithmetic,
clippy::explicit_counter_loop,
clippy::needless_lifetimes,
clippy::single_component_path_imports,
clippy::uninlined_format_args,
clippy::iter_cloned_collect,
clippy::manual_str_repeat,
clippy::excessive_precision,
clippy::precedence,
clippy::unnecessary_literal_unwrap
)]
use oxicode::{decode_from_slice, encode_to_vec, Decode, Encode};
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct DieCoordinate {
row: u16,
col: u16,
site: u8,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct WaferIdentifier {
wafer_number: u8,
slot: u8,
orientation_notch_deg: f32,
die_grid: Vec<DieCoordinate>,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct LotInfo {
lot_id: String,
product_code: String,
technology_node_nm: u16,
wafer_count: u8,
priority: u8,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct WaferLot {
lot: LotInfo,
wafers: Vec<WaferIdentifier>,
route_id: String,
current_step: u32,
total_steps: u32,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct OverlayError {
x_offset_nm: f64,
y_offset_nm: f64,
rotation_urad: f64,
magnification_ppm: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct ExposureSettings {
dose_mj_per_cm2: f64,
focus_offset_nm: f64,
numerical_aperture: f64,
sigma_inner: f64,
sigma_outer: f64,
wavelength_nm: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct ReticleInfo {
reticle_id: String,
layer_name: String,
field_size_x_mm: f64,
field_size_y_mm: f64,
pellicle_attached: bool,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct LithoStep {
step_name: String,
tool_id: String,
reticle: ReticleInfo,
exposure: ExposureSettings,
overlay: OverlayError,
alignment_marks_used: u8,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct GasFlow {
gas_name: String,
flow_sccm: f64,
mfc_channel: u8,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct RfSource {
frequency_mhz: f64,
power_watts: f64,
pulsed: bool,
duty_cycle_pct: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct EtchStep {
step_label: String,
duration_sec: f64,
pressure_mtorr: f64,
temperature_c: f64,
gases: Vec<GasFlow>,
source_rf: RfSource,
bias_rf: RfSource,
endpoint_signal: Option<String>,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct EtchRecipe {
recipe_id: String,
chamber_id: String,
steps: Vec<EtchStep>,
total_time_sec: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct SlurryConfig {
slurry_type: String,
flow_rate_ml_per_min: f64,
ph_value: f64,
abrasive_pct: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct PadConditioner {
conditioner_type: String,
sweep_speed_rpm: f64,
down_force_lbs: f64,
in_situ: bool,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct CmpProfile {
platen_speed_rpm: f64,
carrier_speed_rpm: f64,
down_force_psi: f64,
polish_time_sec: f64,
slurry: SlurryConfig,
conditioner: PadConditioner,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct CmpProcess {
process_id: String,
layer_target: String,
profiles: Vec<CmpProfile>,
post_clean_recipe: String,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct ImplantSpecies {
element: String,
isotope_mass: u16,
charge_state: u8,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct ImplantDose {
dose_atoms_per_cm2: f64,
energy_kev: f64,
tilt_deg: f64,
twist_deg: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct ImplantProfile {
profile_name: String,
species: ImplantSpecies,
dose_params: ImplantDose,
beam_current_ua: f64,
scan_mode: String,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct IonImplantRecipe {
recipe_id: String,
tool_name: String,
profiles: Vec<ImplantProfile>,
anneal_required: bool,
anneal_temp_c: Option<f64>,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct CdSemMeasurement {
feature_name: String,
target_cd_nm: f64,
measured_cd_nm: f64,
lwr_nm: f64,
lwe_nm: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct OcdMeasurement {
profile_name: String,
cd_top_nm: f64,
cd_bottom_nm: f64,
sidewall_angle_deg: f64,
height_nm: f64,
goodness_of_fit: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct FilmThickness {
film_type: String,
target_nm: f64,
measured_nm: f64,
uniformity_pct: f64,
measurement_points: u16,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct MetrologyReport {
wafer_id: String,
step_name: String,
cd_sem: Vec<CdSemMeasurement>,
ocd: Vec<OcdMeasurement>,
film: Vec<FilmThickness>,
timestamp_epoch: u64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct BinCode {
bin_number: u16,
bin_name: String,
pass_fail: bool,
count: u32,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct DieBinResult {
die: DieCoordinate,
hard_bin: u16,
soft_bin: u16,
test_time_ms: u32,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct WaferMap {
wafer_id: String,
die_results: Vec<DieBinResult>,
total_die: u32,
good_die: u32,
yield_pct: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct YieldReport {
lot_id: String,
wafer_maps: Vec<WaferMap>,
bin_definitions: Vec<BinCode>,
lot_yield_pct: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct ParticleCount {
size_threshold_um: f64,
count_per_cubic_ft: u32,
measurement_location: String,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct EnvironmentReading {
temperature_c: f64,
humidity_pct: f64,
pressure_pa: f64,
airflow_m_per_s: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct CleanRoomZone {
zone_name: String,
iso_class: u8,
environment: EnvironmentReading,
particle_counts: Vec<ParticleCount>,
personnel_count: u16,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct FabEnvironment {
fab_name: String,
zones: Vec<CleanRoomZone>,
total_area_sqm: f64,
monitoring_interval_sec: u32,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct FurnaceRamp {
segment_name: String,
start_temp_c: f64,
end_temp_c: f64,
ramp_rate_c_per_min: f64,
hold_time_min: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct FurnaceGas {
gas_name: String,
flow_slm: f64,
start_time_min: f64,
stop_time_min: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct FurnaceRecipe {
recipe_name: String,
tube_id: String,
ramp_segments: Vec<FurnaceRamp>,
gas_profile: Vec<FurnaceGas>,
boat_rotation_rpm: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct DiffusionRun {
run_id: String,
lot: LotInfo,
recipe: FurnaceRecipe,
oxide_target_nm: f64,
oxide_measured_nm: Option<f64>,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct PrecursorGas {
chemical_name: String,
flow_sccm: f64,
bubbler_temp_c: Option<f64>,
carrier_gas: Option<String>,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct DepositionConditions {
temperature_c: f64,
pressure_torr: f64,
rf_power_watts: Option<f64>,
dc_power_kw: Option<f64>,
substrate_bias_v: Option<f64>,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct DepositionLayer {
layer_name: String,
method: String,
precursors: Vec<PrecursorGas>,
conditions: DepositionConditions,
target_thickness_nm: f64,
deposition_rate_nm_per_min: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct DepositionProcess {
process_id: String,
tool_id: String,
layers: Vec<DepositionLayer>,
total_time_min: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct TransistorParams {
device_type: String,
channel_length_nm: f64,
channel_width_nm: f64,
vt_mv: f64,
idsat_ua_per_um: f64,
ioff_pa_per_um: f64,
subthreshold_swing_mv_per_dec: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct LeakageCurrent {
junction_name: String,
leakage_na: f64,
voltage_v: f64,
temperature_c: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct EtestSite {
site_id: u16,
die: DieCoordinate,
transistors: Vec<TransistorParams>,
leakage: Vec<LeakageCurrent>,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct EtestWafer {
wafer_id: String,
sites: Vec<EtestSite>,
pass: bool,
median_vt_mv: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct WireBondSpec {
pad_name: String,
wire_material: String,
wire_diameter_um: f64,
loop_height_um: f64,
ball_size_um: f64,
bond_force_gf: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct FlipChipBump {
bump_id: String,
material: String,
diameter_um: f64,
pitch_um: f64,
height_um: f64,
underfill: bool,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct PackageSubstrate {
substrate_type: String,
layer_count: u8,
thickness_mm: f64,
material: String,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct PackageDesign {
package_type: String,
body_size_mm_x: f64,
body_size_mm_y: f64,
substrate: PackageSubstrate,
wire_bonds: Vec<WireBondSpec>,
flip_chip_bumps: Vec<FlipChipBump>,
lead_count: u16,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct EsdTestResult {
model: String,
voltage_kv: f64,
pin_name: String,
passed: bool,
leakage_after_na: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct EsdProtection {
clamp_type: String,
trigger_voltage_v: f64,
holding_voltage_v: f64,
on_resistance_ohm: f64,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct EsdSpec {
device_name: String,
protection_cells: Vec<EsdProtection>,
test_results: Vec<EsdTestResult>,
classification: String,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct DefectLocation {
die: DieCoordinate,
x_um: f64,
y_um: f64,
layer: String,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct DefectFeature {
size_um: f64,
aspect_ratio: f64,
brightness: f64,
polarity: String,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct DefectEntry {
defect_id: u64,
location: DefectLocation,
feature: DefectFeature,
classification: String,
killer: bool,
review_completed: bool,
}
#[derive(Debug, PartialEq, Clone, Encode, Decode)]
struct DefectInspectionReport {
wafer_id: String,
tool_id: String,
recipe_name: String,
defects: Vec<DefectEntry>,
total_defects: u32,
killer_defects: u32,
defect_density_per_cm2: f64,
}
#[test]
fn test_wafer_lot_tracking() {
let lot = WaferLot {
lot: LotInfo {
lot_id: "N7-2026-0315-A".into(),
product_code: "APEX7".into(),
technology_node_nm: 7,
wafer_count: 25,
priority: 1,
},
wafers: vec![
WaferIdentifier {
wafer_number: 1,
slot: 1,
orientation_notch_deg: 0.0,
die_grid: vec![
DieCoordinate {
row: 0,
col: 0,
site: 1,
},
DieCoordinate {
row: 0,
col: 1,
site: 1,
},
DieCoordinate {
row: 1,
col: 0,
site: 1,
},
],
},
WaferIdentifier {
wafer_number: 2,
slot: 2,
orientation_notch_deg: 0.0,
die_grid: vec![
DieCoordinate {
row: 0,
col: 0,
site: 1,
},
DieCoordinate {
row: 0,
col: 1,
site: 2,
},
],
},
],
route_id: "ROUTE-N7-LOGIC-V3".into(),
current_step: 42,
total_steps: 320,
};
let encoded = encode_to_vec(&lot).expect("encode wafer lot");
let (decoded, _): (WaferLot, _) = decode_from_slice(&encoded).expect("decode wafer lot");
assert_eq!(lot, decoded);
}
#[test]
fn test_photolithography_full_step() {
let litho = LithoStep {
step_name: "M1_PHOTO".into(),
tool_id: "ASML-NXT2000-01".into(),
reticle: ReticleInfo {
reticle_id: "RTL-M1-V2R3".into(),
layer_name: "METAL1".into(),
field_size_x_mm: 26.0,
field_size_y_mm: 33.0,
pellicle_attached: true,
},
exposure: ExposureSettings {
dose_mj_per_cm2: 30.5,
focus_offset_nm: -10.0,
numerical_aperture: 0.33,
sigma_inner: 0.6,
sigma_outer: 0.9,
wavelength_nm: 13.5,
},
overlay: OverlayError {
x_offset_nm: 0.8,
y_offset_nm: -0.3,
rotation_urad: 0.12,
magnification_ppm: 0.05,
},
alignment_marks_used: 8,
};
let encoded = encode_to_vec(&litho).expect("encode litho step");
let (decoded, _): (LithoStep, _) = decode_from_slice(&encoded).expect("decode litho step");
assert_eq!(litho, decoded);
}
#[test]
fn test_etch_recipe_multi_step() {
let recipe = EtchRecipe {
recipe_id: "ETCH-POLY-HK-V4".into(),
chamber_id: "LAM-KIYO-C3".into(),
steps: vec![
EtchStep {
step_label: "Breakthrough".into(),
duration_sec: 5.0,
pressure_mtorr: 4.0,
temperature_c: 60.0,
gases: vec![
GasFlow {
gas_name: "Cl2".into(),
flow_sccm: 100.0,
mfc_channel: 1,
},
GasFlow {
gas_name: "BCl3".into(),
flow_sccm: 50.0,
mfc_channel: 2,
},
],
source_rf: RfSource {
frequency_mhz: 60.0,
power_watts: 800.0,
pulsed: false,
duty_cycle_pct: 100.0,
},
bias_rf: RfSource {
frequency_mhz: 13.56,
power_watts: 50.0,
pulsed: true,
duty_cycle_pct: 30.0,
},
endpoint_signal: None,
},
EtchStep {
step_label: "Main Etch".into(),
duration_sec: 45.0,
pressure_mtorr: 8.0,
temperature_c: 55.0,
gases: vec![
GasFlow {
gas_name: "HBr".into(),
flow_sccm: 200.0,
mfc_channel: 3,
},
GasFlow {
gas_name: "O2".into(),
flow_sccm: 5.0,
mfc_channel: 4,
},
GasFlow {
gas_name: "He".into(),
flow_sccm: 300.0,
mfc_channel: 5,
},
],
source_rf: RfSource {
frequency_mhz: 60.0,
power_watts: 400.0,
pulsed: true,
duty_cycle_pct: 50.0,
},
bias_rf: RfSource {
frequency_mhz: 13.56,
power_watts: 120.0,
pulsed: true,
duty_cycle_pct: 40.0,
},
endpoint_signal: Some("OES-Br-827nm".into()),
},
EtchStep {
step_label: "Over Etch".into(),
duration_sec: 15.0,
pressure_mtorr: 12.0,
temperature_c: 55.0,
gases: vec![
GasFlow {
gas_name: "HBr".into(),
flow_sccm: 150.0,
mfc_channel: 3,
},
GasFlow {
gas_name: "O2".into(),
flow_sccm: 10.0,
mfc_channel: 4,
},
],
source_rf: RfSource {
frequency_mhz: 60.0,
power_watts: 200.0,
pulsed: false,
duty_cycle_pct: 100.0,
},
bias_rf: RfSource {
frequency_mhz: 13.56,
power_watts: 30.0,
pulsed: false,
duty_cycle_pct: 100.0,
},
endpoint_signal: None,
},
],
total_time_sec: 65.0,
};
let encoded = encode_to_vec(&recipe).expect("encode etch recipe");
let (decoded, _): (EtchRecipe, _) = decode_from_slice(&encoded).expect("decode etch recipe");
assert_eq!(recipe, decoded);
}
#[test]
fn test_cmp_polish_process() {
let cmp = CmpProcess {
process_id: "CMP-CU-DUAL-V2".into(),
layer_target: "COPPER_M2".into(),
profiles: vec![
CmpProfile {
platen_speed_rpm: 93.0,
carrier_speed_rpm: 87.0,
down_force_psi: 2.5,
polish_time_sec: 60.0,
slurry: SlurryConfig {
slurry_type: "Barrier-CMP".into(),
flow_rate_ml_per_min: 200.0,
ph_value: 9.5,
abrasive_pct: 3.0,
},
conditioner: PadConditioner {
conditioner_type: "Diamond-Disk".into(),
sweep_speed_rpm: 20.0,
down_force_lbs: 5.0,
in_situ: true,
},
},
CmpProfile {
platen_speed_rpm: 60.0,
carrier_speed_rpm: 55.0,
down_force_psi: 1.2,
polish_time_sec: 30.0,
slurry: SlurryConfig {
slurry_type: "Buff-Clean".into(),
flow_rate_ml_per_min: 300.0,
ph_value: 7.0,
abrasive_pct: 0.5,
},
conditioner: PadConditioner {
conditioner_type: "Brush".into(),
sweep_speed_rpm: 10.0,
down_force_lbs: 2.0,
in_situ: false,
},
},
],
post_clean_recipe: "MEGASONIC-DIW-V3".into(),
};
let encoded = encode_to_vec(&cmp).expect("encode cmp process");
let (decoded, _): (CmpProcess, _) = decode_from_slice(&encoded).expect("decode cmp process");
assert_eq!(cmp, decoded);
}
#[test]
fn test_ion_implant_recipe() {
let recipe = IonImplantRecipe {
recipe_id: "IMPL-NWELL-V5".into(),
tool_name: "AMAT-VIISta-900".into(),
profiles: vec![
ImplantProfile {
profile_name: "N-Well Deep".into(),
species: ImplantSpecies {
element: "P".into(),
isotope_mass: 31,
charge_state: 1,
},
dose_params: ImplantDose {
dose_atoms_per_cm2: 1.5e13,
energy_kev: 500.0,
tilt_deg: 7.0,
twist_deg: 22.0,
},
beam_current_ua: 800.0,
scan_mode: "hybrid".into(),
},
ImplantProfile {
profile_name: "N-Well Retro".into(),
species: ImplantSpecies {
element: "P".into(),
isotope_mass: 31,
charge_state: 2,
},
dose_params: ImplantDose {
dose_atoms_per_cm2: 5.0e12,
energy_kev: 180.0,
tilt_deg: 7.0,
twist_deg: 22.0,
},
beam_current_ua: 500.0,
scan_mode: "parallel".into(),
},
],
anneal_required: true,
anneal_temp_c: Some(1050.0),
};
let encoded = encode_to_vec(&recipe).expect("encode implant recipe");
let (decoded, _): (IonImplantRecipe, _) =
decode_from_slice(&encoded).expect("decode implant recipe");
assert_eq!(recipe, decoded);
}
#[test]
fn test_metrology_report_cd_sem() {
let report = MetrologyReport {
wafer_id: "W01-N7-0315".into(),
step_name: "POST-ETCH-M1".into(),
cd_sem: vec![
CdSemMeasurement {
feature_name: "M1_LINE_H".into(),
target_cd_nm: 28.0,
measured_cd_nm: 27.6,
lwr_nm: 1.8,
lwe_nm: 1.2,
},
CdSemMeasurement {
feature_name: "M1_SPACE_V".into(),
target_cd_nm: 28.0,
measured_cd_nm: 28.3,
lwr_nm: 2.0,
lwe_nm: 1.5,
},
],
ocd: vec![OcdMeasurement {
profile_name: "M1_TRENCH".into(),
cd_top_nm: 29.5,
cd_bottom_nm: 26.0,
sidewall_angle_deg: 86.5,
height_nm: 100.0,
goodness_of_fit: 0.998,
}],
film: vec![],
timestamp_epoch: 1710489600,
};
let encoded = encode_to_vec(&report).expect("encode metrology report");
let (decoded, _): (MetrologyReport, _) =
decode_from_slice(&encoded).expect("decode metrology report");
assert_eq!(report, decoded);
}
#[test]
fn test_metrology_film_thickness() {
let report = MetrologyReport {
wafer_id: "W12-N5-0410".into(),
step_name: "POST-DEP-ILD".into(),
cd_sem: vec![],
ocd: vec![],
film: vec![
FilmThickness {
film_type: "SiO2-PECVD".into(),
target_nm: 500.0,
measured_nm: 498.3,
uniformity_pct: 1.2,
measurement_points: 49,
},
FilmThickness {
film_type: "SiN-Cap".into(),
target_nm: 30.0,
measured_nm: 30.8,
uniformity_pct: 2.1,
measurement_points: 49,
},
],
timestamp_epoch: 1710576000,
};
let encoded = encode_to_vec(&report).expect("encode film report");
let (decoded, _): (MetrologyReport, _) =
decode_from_slice(&encoded).expect("decode film report");
assert_eq!(report, decoded);
}
#[test]
fn test_yield_analysis_wafer_map() {
let yield_rpt = YieldReport {
lot_id: "LOT-2026-0315-B".into(),
wafer_maps: vec![WaferMap {
wafer_id: "W03".into(),
die_results: vec![
DieBinResult {
die: DieCoordinate {
row: 5,
col: 10,
site: 1,
},
hard_bin: 1,
soft_bin: 100,
test_time_ms: 450,
},
DieBinResult {
die: DieCoordinate {
row: 5,
col: 11,
site: 1,
},
hard_bin: 1,
soft_bin: 100,
test_time_ms: 460,
},
DieBinResult {
die: DieCoordinate {
row: 6,
col: 10,
site: 1,
},
hard_bin: 5,
soft_bin: 510,
test_time_ms: 380,
},
],
total_die: 500,
good_die: 480,
yield_pct: 96.0,
}],
bin_definitions: vec![
BinCode {
bin_number: 1,
bin_name: "PASS".into(),
pass_fail: true,
count: 480,
},
BinCode {
bin_number: 5,
bin_name: "FAIL-LEAK".into(),
pass_fail: false,
count: 20,
},
],
lot_yield_pct: 96.0,
};
let encoded = encode_to_vec(&yield_rpt).expect("encode yield report");
let (decoded, _): (YieldReport, _) = decode_from_slice(&encoded).expect("decode yield report");
assert_eq!(yield_rpt, decoded);
}
#[test]
fn test_clean_room_environment() {
let env = FabEnvironment {
fab_name: "FAB-12-HSINCHU".into(),
zones: vec![
CleanRoomZone {
zone_name: "LITHO-BAY".into(),
iso_class: 3,
environment: EnvironmentReading {
temperature_c: 22.0,
humidity_pct: 43.0,
pressure_pa: 101425.0,
airflow_m_per_s: 0.45,
},
particle_counts: vec![
ParticleCount {
size_threshold_um: 0.1,
count_per_cubic_ft: 35,
measurement_location: "Above-Scanner".into(),
},
ParticleCount {
size_threshold_um: 0.5,
count_per_cubic_ft: 2,
measurement_location: "Track-Load".into(),
},
],
personnel_count: 3,
},
CleanRoomZone {
zone_name: "DIFFUSION-BAY".into(),
iso_class: 5,
environment: EnvironmentReading {
temperature_c: 22.5,
humidity_pct: 44.0,
pressure_pa: 101400.0,
airflow_m_per_s: 0.35,
},
particle_counts: vec![ParticleCount {
size_threshold_um: 0.5,
count_per_cubic_ft: 80,
measurement_location: "Furnace-Front".into(),
}],
personnel_count: 2,
},
],
total_area_sqm: 12000.0,
monitoring_interval_sec: 300,
};
let encoded = encode_to_vec(&env).expect("encode fab environment");
let (decoded, _): (FabEnvironment, _) =
decode_from_slice(&encoded).expect("decode fab environment");
assert_eq!(env, decoded);
}
#[test]
fn test_diffusion_furnace_recipe() {
let run = DiffusionRun {
run_id: "DIFF-20260315-001".into(),
lot: LotInfo {
lot_id: "LOT-GATE-OX".into(),
product_code: "N5-HPC".into(),
technology_node_nm: 5,
wafer_count: 25,
priority: 2,
},
recipe: FurnaceRecipe {
recipe_name: "GATE-OX-12A".into(),
tube_id: "TUBE-04".into(),
ramp_segments: vec![
FurnaceRamp {
segment_name: "Ramp-Up".into(),
start_temp_c: 600.0,
end_temp_c: 850.0,
ramp_rate_c_per_min: 5.0,
hold_time_min: 0.0,
},
FurnaceRamp {
segment_name: "Oxidation".into(),
start_temp_c: 850.0,
end_temp_c: 850.0,
ramp_rate_c_per_min: 0.0,
hold_time_min: 12.0,
},
FurnaceRamp {
segment_name: "Anneal".into(),
start_temp_c: 850.0,
end_temp_c: 1000.0,
ramp_rate_c_per_min: 3.0,
hold_time_min: 5.0,
},
FurnaceRamp {
segment_name: "Cool-Down".into(),
start_temp_c: 1000.0,
end_temp_c: 600.0,
ramp_rate_c_per_min: -2.0,
hold_time_min: 0.0,
},
],
gas_profile: vec![
FurnaceGas {
gas_name: "N2".into(),
flow_slm: 10.0,
start_time_min: 0.0,
stop_time_min: 50.0,
},
FurnaceGas {
gas_name: "O2-DRY".into(),
flow_slm: 5.0,
start_time_min: 50.0,
stop_time_min: 62.0,
},
FurnaceGas {
gas_name: "N2O".into(),
flow_slm: 2.0,
start_time_min: 62.0,
stop_time_min: 67.0,
},
],
boat_rotation_rpm: 1.5,
},
oxide_target_nm: 1.2,
oxide_measured_nm: Some(1.18),
};
let encoded = encode_to_vec(&run).expect("encode diffusion run");
let (decoded, _): (DiffusionRun, _) =
decode_from_slice(&encoded).expect("decode diffusion run");
assert_eq!(run, decoded);
}
#[test]
fn test_cvd_deposition_process() {
let dep = DepositionProcess {
process_id: "CVD-ILD-V6".into(),
tool_id: "AMAT-PRODUCER-07".into(),
layers: vec![
DepositionLayer {
layer_name: "USG-Liner".into(),
method: "PECVD".into(),
precursors: vec![
PrecursorGas {
chemical_name: "TEOS".into(),
flow_sccm: 1200.0,
bubbler_temp_c: Some(35.0),
carrier_gas: Some("He".into()),
},
PrecursorGas {
chemical_name: "O2".into(),
flow_sccm: 600.0,
bubbler_temp_c: None,
carrier_gas: None,
},
],
conditions: DepositionConditions {
temperature_c: 400.0,
pressure_torr: 8.0,
rf_power_watts: Some(700.0),
dc_power_kw: None,
substrate_bias_v: None,
},
target_thickness_nm: 50.0,
deposition_rate_nm_per_min: 250.0,
},
DepositionLayer {
layer_name: "Low-k-ILD".into(),
method: "PECVD".into(),
precursors: vec![PrecursorGas {
chemical_name: "DEMS".into(),
flow_sccm: 800.0,
bubbler_temp_c: Some(40.0),
carrier_gas: Some("He".into()),
}],
conditions: DepositionConditions {
temperature_c: 350.0,
pressure_torr: 6.0,
rf_power_watts: Some(500.0),
dc_power_kw: None,
substrate_bias_v: Some(-50.0),
},
target_thickness_nm: 200.0,
deposition_rate_nm_per_min: 150.0,
},
],
total_time_min: 3.5,
};
let encoded = encode_to_vec(&dep).expect("encode deposition process");
let (decoded, _): (DepositionProcess, _) =
decode_from_slice(&encoded).expect("decode deposition process");
assert_eq!(dep, decoded);
}
#[test]
fn test_pvd_sputtering_layer() {
let dep = DepositionProcess {
process_id: "PVD-BARRIER-TaN".into(),
tool_id: "AMAT-ENDURA-03".into(),
layers: vec![DepositionLayer {
layer_name: "TaN-Barrier".into(),
method: "PVD-Reactive".into(),
precursors: vec![PrecursorGas {
chemical_name: "N2".into(),
flow_sccm: 30.0,
bubbler_temp_c: None,
carrier_gas: None,
}],
conditions: DepositionConditions {
temperature_c: 250.0,
pressure_torr: 0.003,
rf_power_watts: None,
dc_power_kw: Some(12.0),
substrate_bias_v: Some(-100.0),
},
target_thickness_nm: 3.0,
deposition_rate_nm_per_min: 15.0,
}],
total_time_min: 0.2,
};
let encoded = encode_to_vec(&dep).expect("encode pvd process");
let (decoded, _): (DepositionProcess, _) =
decode_from_slice(&encoded).expect("decode pvd process");
assert_eq!(dep, decoded);
}
#[test]
fn test_electrical_test_transistor_params() {
let etest = EtestWafer {
wafer_id: "W07-N7-ETEST".into(),
sites: vec![
EtestSite {
site_id: 1,
die: DieCoordinate {
row: 12,
col: 15,
site: 1,
},
transistors: vec![
TransistorParams {
device_type: "NFET".into(),
channel_length_nm: 7.0,
channel_width_nm: 100.0,
vt_mv: 280.0,
idsat_ua_per_um: 1050.0,
ioff_pa_per_um: 5.0,
subthreshold_swing_mv_per_dec: 68.0,
},
TransistorParams {
device_type: "PFET".into(),
channel_length_nm: 7.0,
channel_width_nm: 100.0,
vt_mv: -310.0,
idsat_ua_per_um: 780.0,
ioff_pa_per_um: 3.0,
subthreshold_swing_mv_per_dec: 70.0,
},
],
leakage: vec![LeakageCurrent {
junction_name: "N+/P-Well".into(),
leakage_na: 0.12,
voltage_v: -1.0,
temperature_c: 25.0,
}],
},
EtestSite {
site_id: 2,
die: DieCoordinate {
row: 12,
col: 16,
site: 1,
},
transistors: vec![TransistorParams {
device_type: "NFET".into(),
channel_length_nm: 7.0,
channel_width_nm: 100.0,
vt_mv: 275.0,
idsat_ua_per_um: 1060.0,
ioff_pa_per_um: 4.8,
subthreshold_swing_mv_per_dec: 67.5,
}],
leakage: vec![],
},
],
pass: true,
median_vt_mv: 278.0,
};
let encoded = encode_to_vec(&etest).expect("encode etest wafer");
let (decoded, _): (EtestWafer, _) = decode_from_slice(&encoded).expect("decode etest wafer");
assert_eq!(etest, decoded);
}
#[test]
fn test_wire_bond_packaging() {
let pkg = PackageDesign {
package_type: "QFN-48".into(),
body_size_mm_x: 7.0,
body_size_mm_y: 7.0,
substrate: PackageSubstrate {
substrate_type: "Laminate".into(),
layer_count: 4,
thickness_mm: 0.4,
material: "BT-Resin".into(),
},
wire_bonds: vec![
WireBondSpec {
pad_name: "VDD".into(),
wire_material: "Au".into(),
wire_diameter_um: 25.0,
loop_height_um: 200.0,
ball_size_um: 55.0,
bond_force_gf: 30.0,
},
WireBondSpec {
pad_name: "IO_0".into(),
wire_material: "Au".into(),
wire_diameter_um: 20.0,
loop_height_um: 180.0,
ball_size_um: 48.0,
bond_force_gf: 25.0,
},
],
flip_chip_bumps: vec![],
lead_count: 48,
};
let encoded = encode_to_vec(&pkg).expect("encode wire bond package");
let (decoded, _): (PackageDesign, _) =
decode_from_slice(&encoded).expect("decode wire bond package");
assert_eq!(pkg, decoded);
}
#[test]
fn test_flip_chip_packaging() {
let pkg = PackageDesign {
package_type: "FCBGA-1024".into(),
body_size_mm_x: 35.0,
body_size_mm_y: 35.0,
substrate: PackageSubstrate {
substrate_type: "ABF-Buildup".into(),
layer_count: 12,
thickness_mm: 1.2,
material: "ABF-GX92".into(),
},
wire_bonds: vec![],
flip_chip_bumps: vec![
FlipChipBump {
bump_id: "C4-A1".into(),
material: "SnAg".into(),
diameter_um: 80.0,
pitch_um: 150.0,
height_um: 50.0,
underfill: true,
},
FlipChipBump {
bump_id: "C4-A2".into(),
material: "SnAg".into(),
diameter_um: 80.0,
pitch_um: 150.0,
height_um: 50.0,
underfill: true,
},
FlipChipBump {
bump_id: "uBump-B1".into(),
material: "Cu-Pillar".into(),
diameter_um: 25.0,
pitch_um: 40.0,
height_um: 30.0,
underfill: true,
},
],
lead_count: 1024,
};
let encoded = encode_to_vec(&pkg).expect("encode flip chip package");
let (decoded, _): (PackageDesign, _) =
decode_from_slice(&encoded).expect("decode flip chip package");
assert_eq!(pkg, decoded);
}
#[test]
fn test_esd_protection_spec() {
let esd = EsdSpec {
device_name: "APEX7-IO-PAD".into(),
protection_cells: vec![
EsdProtection {
clamp_type: "GGNMOS".into(),
trigger_voltage_v: 6.5,
holding_voltage_v: 3.5,
on_resistance_ohm: 2.5,
},
EsdProtection {
clamp_type: "RC-Triggered-Clamp".into(),
trigger_voltage_v: 5.0,
holding_voltage_v: 1.8,
on_resistance_ohm: 1.0,
},
],
test_results: vec![
EsdTestResult {
model: "HBM".into(),
voltage_kv: 2.0,
pin_name: "IO_5".into(),
passed: true,
leakage_after_na: 0.8,
},
EsdTestResult {
model: "CDM".into(),
voltage_kv: 0.5,
pin_name: "IO_5".into(),
passed: true,
leakage_after_na: 1.2,
},
EsdTestResult {
model: "HBM".into(),
voltage_kv: 2.0,
pin_name: "VDD".into(),
passed: true,
leakage_after_na: 0.5,
},
],
classification: "Class-2".into(),
};
let encoded = encode_to_vec(&esd).expect("encode esd spec");
let (decoded, _): (EsdSpec, _) = decode_from_slice(&encoded).expect("decode esd spec");
assert_eq!(esd, decoded);
}
#[test]
fn test_defect_inspection_report() {
let report = DefectInspectionReport {
wafer_id: "W19-N7-INSP".into(),
tool_id: "KLA-2925-01".into(),
recipe_name: "M1-POST-ETCH-BRIGHT".into(),
defects: vec![
DefectEntry {
defect_id: 10001,
location: DefectLocation {
die: DieCoordinate {
row: 8,
col: 12,
site: 1,
},
x_um: 1523.4,
y_um: 2801.7,
layer: "METAL1".into(),
},
feature: DefectFeature {
size_um: 0.08,
aspect_ratio: 1.2,
brightness: 180.0,
polarity: "BRIGHT".into(),
},
classification: "BRIDGE".into(),
killer: true,
review_completed: true,
},
DefectEntry {
defect_id: 10002,
location: DefectLocation {
die: DieCoordinate {
row: 9,
col: 14,
site: 1,
},
x_um: 3100.5,
y_um: 450.2,
layer: "METAL1".into(),
},
feature: DefectFeature {
size_um: 0.15,
aspect_ratio: 3.5,
brightness: 50.0,
polarity: "DARK".into(),
},
classification: "OPEN".into(),
killer: true,
review_completed: true,
},
DefectEntry {
defect_id: 10003,
location: DefectLocation {
die: DieCoordinate {
row: 3,
col: 5,
site: 1,
},
x_um: 800.0,
y_um: 1200.0,
layer: "METAL1".into(),
},
feature: DefectFeature {
size_um: 0.04,
aspect_ratio: 1.0,
brightness: 120.0,
polarity: "BRIGHT".into(),
},
classification: "PARTICLE".into(),
killer: false,
review_completed: false,
},
],
total_defects: 3,
killer_defects: 2,
defect_density_per_cm2: 0.15,
};
let encoded = encode_to_vec(&report).expect("encode defect report");
let (decoded, _): (DefectInspectionReport, _) =
decode_from_slice(&encoded).expect("decode defect report");
assert_eq!(report, decoded);
}
#[test]
fn test_implant_without_anneal() {
let recipe = IonImplantRecipe {
recipe_id: "IMPL-HALO-V2".into(),
tool_name: "AXCELIS-PURION-H".into(),
profiles: vec![ImplantProfile {
profile_name: "Halo-NMOS".into(),
species: ImplantSpecies {
element: "In".into(),
isotope_mass: 115,
charge_state: 1,
},
dose_params: ImplantDose {
dose_atoms_per_cm2: 3.0e13,
energy_kev: 60.0,
tilt_deg: 28.0,
twist_deg: 0.0,
},
beam_current_ua: 200.0,
scan_mode: "quad".into(),
}],
anneal_required: false,
anneal_temp_c: None,
};
let encoded = encode_to_vec(&recipe).expect("encode halo implant");
let (decoded, _): (IonImplantRecipe, _) =
decode_from_slice(&encoded).expect("decode halo implant");
assert_eq!(recipe, decoded);
}
#[test]
fn test_multi_wafer_yield_report() {
let make_map = |id: &str, good: u32, total: u32| -> WaferMap {
WaferMap {
wafer_id: id.into(),
die_results: vec![
DieBinResult {
die: DieCoordinate {
row: 0,
col: 0,
site: 1,
},
hard_bin: 1,
soft_bin: 100,
test_time_ms: 500,
},
DieBinResult {
die: DieCoordinate {
row: 0,
col: 1,
site: 1,
},
hard_bin: 2,
soft_bin: 200,
test_time_ms: 520,
},
],
total_die: total,
good_die: good,
yield_pct: (good as f64 / total as f64) * 100.0,
}
};
let report = YieldReport {
lot_id: "LOT-MULTI-YIELD".into(),
wafer_maps: vec![
make_map("W01", 490, 500),
make_map("W02", 485, 500),
make_map("W03", 495, 500),
],
bin_definitions: vec![
BinCode {
bin_number: 1,
bin_name: "PASS".into(),
pass_fail: true,
count: 1470,
},
BinCode {
bin_number: 2,
bin_name: "FAIL-VT".into(),
pass_fail: false,
count: 30,
},
],
lot_yield_pct: 98.0,
};
let encoded = encode_to_vec(&report).expect("encode multi-wafer yield");
let (decoded, _): (YieldReport, _) =
decode_from_slice(&encoded).expect("decode multi-wafer yield");
assert_eq!(report, decoded);
}
#[test]
fn test_overlay_tight_tolerance() {
let litho = LithoStep {
step_name: "VIA1_PHOTO".into(),
tool_id: "ASML-NXE3400-02".into(),
reticle: ReticleInfo {
reticle_id: "RTL-V1-V1R1".into(),
layer_name: "VIA1".into(),
field_size_x_mm: 26.0,
field_size_y_mm: 33.0,
pellicle_attached: true,
},
exposure: ExposureSettings {
dose_mj_per_cm2: 33.0,
focus_offset_nm: -5.0,
numerical_aperture: 0.33,
sigma_inner: 0.5,
sigma_outer: 0.85,
wavelength_nm: 13.5,
},
overlay: OverlayError {
x_offset_nm: 0.15,
y_offset_nm: -0.08,
rotation_urad: 0.02,
magnification_ppm: 0.01,
},
alignment_marks_used: 16,
};
let encoded = encode_to_vec(&litho).expect("encode overlay litho");
let (decoded, _): (LithoStep, _) = decode_from_slice(&encoded).expect("decode overlay litho");
assert_eq!(litho, decoded);
}
#[test]
fn test_diffusion_no_measurement() {
let run = DiffusionRun {
run_id: "DIFF-20260315-005".into(),
lot: LotInfo {
lot_id: "LOT-LINER-OX".into(),
product_code: "N3-HVM".into(),
technology_node_nm: 3,
wafer_count: 13,
priority: 3,
},
recipe: FurnaceRecipe {
recipe_name: "LINER-OX-5A".into(),
tube_id: "TUBE-09".into(),
ramp_segments: vec![FurnaceRamp {
segment_name: "Rapid-Ox".into(),
start_temp_c: 700.0,
end_temp_c: 700.0,
ramp_rate_c_per_min: 0.0,
hold_time_min: 2.0,
}],
gas_profile: vec![FurnaceGas {
gas_name: "O2-DRY".into(),
flow_slm: 3.0,
start_time_min: 0.0,
stop_time_min: 2.0,
}],
boat_rotation_rpm: 2.0,
},
oxide_target_nm: 0.5,
oxide_measured_nm: None,
};
let encoded = encode_to_vec(&run).expect("encode liner ox run");
let (decoded, _): (DiffusionRun, _) = decode_from_slice(&encoded).expect("decode liner ox run");
assert_eq!(run, decoded);
}
#[test]
fn test_empty_defect_report() {
let report = DefectInspectionReport {
wafer_id: "W25-CLEAN".into(),
tool_id: "KLA-2925-02".into(),
recipe_name: "BARE-SI-BASELINE".into(),
defects: vec![],
total_defects: 0,
killer_defects: 0,
defect_density_per_cm2: 0.0,
};
let encoded = encode_to_vec(&report).expect("encode clean defect report");
let (decoded, _): (DefectInspectionReport, _) =
decode_from_slice(&encoded).expect("decode clean defect report");
assert_eq!(report, decoded);
}